ASE, the global leader in semiconductor packaging and testing, held the "13th Packaging Technology Research Conference" at its Kaohsiung factory to showcase the results of years of intensive industry-university cooperation. Together with N...
ASE, the global leader in semiconductor packaging and testing, held the "13th Packaging Technology Research Conference" at its Kaohsiung factory to showcase the results of years of intensive industry-university cooperation. Together with National Cheng Kung University, Sun Yat-sen University, National Chung Cheng University and Kaohsiung University of Science and Technology, we have implemented 16 research projects, focusing on the two major themes of "advanced packaging and module packaging product development" and "key process technology development", fully demonstrating the innovative breakthroughs and practical applications of AI smart manufacturing in the field of high-end packaging.
Wang Mengren, deputy general manager of ASE, said that packaging research has become an important platform for the company to promote technological innovation, talent cultivation and cross-domain cooperation. Through industry-university collaboration, we continue to integrate R&D energy and promote the transformation of the packaging and testing industry towards smart manufacturing. Over the past 13 years, ASE has collaborated with universities and colleges to complete 188 projects, and each achievement is a concrete demonstration of technological deepening and innovative application. Professor Lin Guanglong of National Cheng Kung University and Professor Guo Zhenkun, deputy dean of the School of Engineering of Sun Yat-sen University, delivered speeches on behalf of the academic community, affirming ASE's long-term promotion of industry-university cooperation, which has enabled academic research results to be put into production, accelerated technology translation, and deepened the two-way connection between chemical research and industry.
This year's technical research center focuses on "AI smart manufacturing and efficient packaging innovation", and its research directions cover many aspects such as high-end process simulation, material improvement, structural analysis and heat transfer management. The results are outstanding, including the use of AI simulation technology combined with intelligent design, applied to high-end products such as CoWoS and FOCoS, which can accurately predict process parameters and quickly complete customized mold design, greatly improving development efficiency and yield. At the same time, the team constructed a mobile phone system-level heat dissipation model, developed a 60GHz AiP high-yield energy test solution and a millimeter-wave package substrate antenna, demonstrating its forward-looking layout for new generation mobile communication applications.
In the field of "key process technology development", research results also demonstrate the substantial benefits of AI introduction. The team used AI and real-time data analysis technology to establish an intelligent automatic correction system to optimize the stability of the PNL Wafer process. Through statistical analysis, it found the key coefficients of the material, redefined the baking conditions, and replaced the Solder TIM IMC component with low-cost materials, effectively reducing manufacturing costs. In addition, the coating quality of the packaging mold has been significantly improved, and the anti-sticking and durability have been greatly improved. A real-time optical measurement system has been developed to detect the thickness of the dispensing film, and a SiC wafer crack and strength model has been established using laser and Weibull analysis to help predict processing quality.
Since its launch in 2013, ASE's packaging technology research has entered its 13th year. Adhering to the core spirit of "industry-university collaboration and technological innovation", it continues to introduce AI, big data and automation technologies, allowing academic and research results to be quickly implemented into mass production, forming a positive cycle of R&D and application. In the future, ASE will focus on smart manufacturing, combine sustainable materials and green process concepts, deepen the global competitiveness of advanced packaging technology, inject long-term growth momentum into Taiwan's semiconductor packaging and testing industry, and continue to lead the industry into a new era of wisdom and sustainability.
